d/crcw-p www.vishay.com vishay revision: 25-apr-13 1 document number: 20009 for technical questions, contact: thickfilmchip@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 lead (pb)-bearing thick film, rectangular, semi-precision chip resistors features ? low temperature coeffi cient (50 ppm/k) and tight tolerances ( 0.25 %) ? lead (pb)-bearing termination plating on ni barrier layer ? metal glaze on high quality ceramic ? material categorization: for definitions of compliance please see www.vishay.com/doc?99912 notes ? these resistors do not feature a limited lifetime when operated within the limits of rated di ssipation, permissible operating voltage and permissible film temperature. however, the resistance typically increase due to the resistors film temperature over operating time generally known as drift. the drift may exceed the stability requirements of an individual application ci rcuit and thereby limits the fun ctional time. ? marking and packaging: see datasheet surface mount resistor marking ( www.vishay.com/doc?20020 ). ? power rating depends on the max. temperature at the solder po int, the component placement density and the substrate material. standard electrical specifications model case size inch case size metric power rating p 70 w limiting element voltage u max. ac rms /dc v temperature coefficient ppm/k tolerance % resistance range ? series d10/crcw0402-p 0402 1005 0.063 50 100 0.5 10r to 1m0 e24; e96 50 0.25, 0.5, 1 100r to 1m d11/crcw0603-p 0603 1608 0.1 75 100 0.5 10r to 10m e24; e96 50 0.25 100r to 1m 0.5, 1 100r to 10m d12/crcw0805-p 0805 2012 0.125 150 100 0.5 10r to 10m e24; e96 50 0.25 100r to 1m 0.5, 1 100r to 10m d25/crcw1206-p 1206 3216 0.25 200 100 0.5 10r to 10m e24; e96 50 0.25 100r to 1m 0.5, 1 100r to 10m crcw1210-p 1210 3225 0.5 200 100 0.5 100r to 1m e24; e96 50 0.5, 1 100r to 1m crcw1218-p 1218 3246 1.0 200 100 0.5 100r to 2m2 e24; e96 50 0.5, 1 100r to 2m2 crcw2010-p 2010 5025 0.75 400 100 0.5 10r to 10m e24; e96 50 0.5, 1 100r to 10m crcw2512-p 2512 6332 1.0 500 100 0.5 10r to 10m e24; e96 50 0.5, 1 100r to 10m
d/crcw-p www.vishay.com vishay revision: 25-apr-13 2 document number: 20009 for technical questions, contact: thickfilmchip@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 note (1) the power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow suppor t of the printed-circuit boar d (thermal resistance). the rated di ssipation applies only if the permitted film temp erature of 155 c is n ot exceeded. technical specifications parameter unit d10/ crcw0402-p d11/ crcw0603-p d12/ crcw0805-p d25/ crcw1206-p crcw1210-p crcw1218-p crcw2010-p crcw2512-p rated dissipation at p 70 (1) w 0.063 0.1 0.125 0.25 0.33 1 0.5 1 operating voltage ? u max. ac rms /dc v 50 75 150 200 200 200 400 500 insulation voltage u ins (1 min) v 75 100 200 300 300 300 300 300 insulation resistance ? > 10 9 operating temperature range c - 55 to + 155 failure rate h -1 0.3 x 10 -9 weight mg 0.65 2 5.5 10 16 29.5 25.5 40.5 part number and product description part number: crcw080525r0dktap model resistance tolerance tcr packaging special crcw0402 crcw0603 crcw0805 crcw1206 crcw1210 crcw1218 crcw2010 crcw2512 r = decimal k = thousand m = million c = 0.25 % d = 0.5 % f = 1.0 % h = 50 ppm/k k = 100 ppm/k ta, tb, tc, td, te, tf, tg, th, tk up to 2 digits p = semi- precision product description: crcw0805-p 100 25r 0.5% rt1 crcw0805-p 100 75r 0.5 % rt1 model tcr resistance tolerance packaging crcw0402-p crcw0603-p crcw0805-p crcw1206-p crcw1210-p crcw1218-p crcw2010-p crcw2512-p 50 ppm/k 100 ppm/k 49k9 = 49.9 ? 5r1 = 5.1 ? 0.25 % 0.5 % 1 % rt1, rt5, rt6, rt7 rt4, r02, r67, r82, rt9 c r c w 0 8 0 5 2 5 r 0 k a p t d
d/crcw-p www.vishay.com vishay revision: 25-apr-13 3 document number: 20009 for technical questions, contact: thickfilmchip@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 packaging model code quantity carrier ta pe width pitch reel diameter d10/crcw0402-p td = rt7 10 000 paper tape acc. to iec 60068-3 type i 8 mm 2 mm 180 mm/7" te = rf4 50 000 330 mm/13" d11/crcw0603-p ta = rt1 5000 8 mm 4 mm 180 mm/7" tb = rt5 10 000 285 mm/11.25" tc = rt6 20 000 330 mm/13" d12/crcw0805-p ta = rt1 5000 8 mm 4 mm 180 mm/7" tb = rt5 10 000 285 mm/11.25" tc = rt6 20 000 330 mm/13" d25/crcw1206-p ta = rt1 5000 8 mm 4 mm 180 mm/7" tb = rt5 10 000 285 mm/11.25" tc = rt6 20 000 330 mm/13" crcw1210-p ta = rt1 5000 12 mm 4 mm 180 mm/7" tb = rt5 10 000 285 mm/11.25" tc = rt6 20 000 330 mm/13" crcw1218-p tk = rt9 4000 blister tape acc. to iec 60068-3 type ii 12 mm 4 mm 180 mm/7" crcw2010-p tf = r02 4000 12 mm 4 mm 180 mm/7" crcw2512-p tg = r67 2000 12 mm 8 mm 180 mm/7" th = r82 4000 4 mm dimensions in millimeters size dimensions solder pad dimensions reflow soldering wave soldering inch metric l w h t1 t2 a b l a b l 0402 1005 1.0 0.05 0.5 0.05 0.35 0.05 0.25 0.05 0.2 0.1 0.4 0.6 0.5 0603 1608 1.55 + 0.10 ? - 0.05 0.85 0.1 0.45 0.05 0.3 0.2 0.3 0.2 0.5 0.9 1.0 0.9 0.9 1.0 0805 2012 2.0 + 0.20 ? - 0.10 1.25 0.15 0.45 0.05 0.3 + 0.20 ? - 0.10 0.3 0.2 0.7 1.3 1.2 0.9 1.3 1.3 1206 3216 3.2 + 0.10 ? - 0.20 1.6 0.15 0.55 0.05 0.45 0.2 0.4 0.2 0.9 1.7 2.0 1.1 1.7 2.3 1210 3225 3.2 0.2 2.5 0.2 0.55 0.05 0.45 0.2 0.4 0.2 0.9 2.5 2.0 1.1 2.5 2.2 1218 3246 3.2 + 0.10 ? - 0.20 4.6 0.15 0.55 0.05 0.45 0.2 0.4 0.2 1.05 4.9 1.9 1.25 4.8 1.9 2010 5025 5.0 0.15 2.5 0.15 0.6 0.1 0.6 0.2 0.6 0.2 1.0 2.5 3.9 1.2 2.5 3.9 2512 6332 6.3 0.2 3.15 0.15 0.6 0.1 0.6 0.2 0.6 0.2 1.0 3.2 5.2 1.2 3.2 5.2
d/crcw-p www.vishay.com vishay revision: 25-apr-13 4 document number: 20009 for technical questions, contact: thickfilmchip@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 functional performance test procedures and requirements en 60115-1 ? clause iec 60068-2 test method test procedure requirements permissible change ( ? r ) stability for product types: stability class 1 or better d/crcw-p 1 ?? to 10 m ? 4.5 - resistance - 0.25 %; 0.5 %; 1 % 4.7 - voltage proof u = 1.4 x u ins ; 60 s no flashover or breakdown 4.13 - short time overload u = 2.5 x ? 2 x u max.; duration acc. to style (0.25 % r + 0.05 ? ) 4.17.2 58 (td) solderability solder bath method; sn60pb40 non-activated flux; (235 5) c (2 0.2) s good tinning ( ? 95 % covered) no visible damage solder bath method; sn96.5ag3cu0.5 non-activated flux; (245 5) c (3 0.3) s good tinning ( ? 95 % covered) no visible damage 4.8.4.2 - temperature coefficient (20/- 55/20) c and (20/125/20) c 50 ppm/k; 100 ppm/k 4.32 21 (uu 3 ) shear (adhesion) rr 1608 and smaller: 9 n rr 2012 and larger: 45 n no visible damage 4.33 21 (uu 1 ) substrate bending depth 2 mm; 3 times no visible da mage, no open circui t in bent position (0.25 % r + 0.05 ? ) 4.19 14 (na) rapid change of temperature 30 min at - 55 c; 30 min at 125 c 5 cycles (0.25 % r + 0.05 ? ) 1000 cycles (1 % r + 0.05 ? ) ambient temperature in amb fraction of rated dissipation p 70 - 50 0 50 100 150 0 50 100 70 c % p 70 x r
d/crcw-p www.vishay.com vishay revision: 25-apr-13 5 document number: 20009 for technical questions, contact: thickfilmchip@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 all tests are carried out in accordance with the following specifications: ? en 60115-1, generic specification ? en 140400, sectional specification ? en 140401-802, detail specification ? iec 60068-2-x, variety of environmental test procedures packaging of components is done in paper or blister ta pes according to iec 60286-3. 4.23 - climatic sequence: - (1 % r + 0.05 ? ) 4.23.2 2 (ba) dry heat 125 c; 16 h 4.23.3 30 (db) damp heat, cyclic 55 c; ? 90 % rh; 24 h; 1 cycle 4.23.4 1 (aa) cold - 55 c; 2 h 4.23.5 13 (m) low air pressure 1 kpa; (25 10) c; 1 h 4.23.6 30 (db) damp heat, cyclic 55 c; ? 90 % rh; 24 h; 5 cycles 4.23.7 - dc load u = 4.25.1 - endurance at 70 c u = ? u max.; 1.5 h on; 0.5 h off; 70 c; 1000 h (1 % r + 0.05 ? ) 70 c; 8000 h (2 % r + 0.05 ? ) 4.18.2 58 (td) resistance to soldering heat solder bath method (260 5) c; (10 1) s (0.25 % r + 0.05 ? ) 4.35 - flamability, needle flame test iec 60695-11-5; 10 s no burning after 30 s 4.24 78 (cab) damp heat, steady state (40 2) c; (93 3) % rh; 56 days (1 % r + 0.05 ? ) 4.25.3 - endurance at upper category temperature 155 c, 1000 h (1 % r + 0.05 ? ) 4.40 - electrostatic discharge (human body model) iec 61340-3-1; 3 pos. + 3 neg. discharges; esd voltage acc. to size (1 % r + 0.05 ? ) 4.29 45 (xa) component solvent resistance isopropyl alcohol; 50 c; method 2 no visible damage 4.30 45 (xa) solvent resistance of marking isopropyl alcohol; 50 c; method 1, toothbrush marking legible, no visible damage 4.22 6 (fc) vibration, endurance by sweeping f = 10 hz to 2000 hz; x, y, z ? 1.5 mm; a ? 200 m/s 2 ; 10 sweeps per axis (0.25 % r + 0.05 ? ) 4.37 - periodic electric overload u = ? 2 x u max.; 0.1 s on; 2.5 s off; 1000 cycles (1 % r + 0.05 ? ) 4.27 - single pulse high voltage overload, 10 s/700 s ? = 10 x ? 2 x u max.; 10 pulses (1 % r + 0.05 ? ) test procedures and requirements en 60115-1 ? clause iec 60068-2 test method test procedure requirements permissible change ( ? r ) stability for product types: stability class 1 or better d/crcw-p 1 ?? to 10 m ? p 70 x r p 70 x r 15 x p 70 x r p 70 x r
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